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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6601-C Issued Date : 1993.03.15 Revised Date : 2000.10.01 Page No. : 1/3
HSA1538
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA1538 is designed for high-definition CRT display video output, wide-band amplifier.
Features
* High fT: fT=500MHz * High breakdown voltage: BVCEO=120Vmin * Small reverse transfer capacitance
Absolute Maximum Ratings (Ta=25C)
* Maximum Temperatures Storage Temperature ....................................................................................................... -50 ~ +150 C Junction Temperature ............................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................................... 1.3 W Total Power Dissipation (Tc=25C) ................................................................................................... 8 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage ............................................................................................... -120 V BVCEO Collector to Emitter Voltage ............................................................................................ -120 V BVEBO Emitter to Base Voltage ...................................................................................................... -3 V IC Collector Current .................................................................................................................. -200 mA Icp Peak Collector Current (Pulse) ............................................................................................ -400 mA
Electrical Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Cre Min. -120 -120 -3 60 40 Typ. 160 400 2.8 2.2 Max. -0.1 -0.1 -1 -1 320 Unit V V V uA uA V V Test Conditions IC=-10uA IC=-1mA IE=-100uA VCB=-80V, IE=0 VBE=-2V, IC=0 IC=-30mA, IB=-3mA IC=-30mA, IB=-3mA IC=-10mA, VCE=-10V IC=-100mA, VCE=-10V VCE=-10V, IC=-50mA VCB=-30V, f=-1MHz VCB=-30V, f=-1MHz
*Pulse Test : Pulse Width 380us, Duty Cycle2%
MHz pF pF
Classification Of hFE1
Rank Range D 60-120 E 100-200 F 160-320
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
10000
Spec. No. : HE6601-C Issued Date : 1993.03.15 Revised Date : 2000.10.01 Page No. : 2/3
Saturation Voltage & Collector Current
100
VCE=10V
Saturation Voltage (mV)
1000
hFE
VCE(sat) @ IC=10IB
100
10
10
1 1 10 100 1000
1 10
Collector Current (mA)
Collector Current (mA)
100
1000
Saturation Voltage & Collector Current
10000 100
Capacitance & Reverse-Biased Voltage
Saturation Voltage (mV)
1000 VBE(sat) @ IC=10IB
Capacitance (Pf)
10
Cob
100 1 10 100 1000
1 1 10 100
Collector Current (mA)
Reverse Biased Voltage (V)
Cutoff Frequency & IC
1000 1
Safe Operating Area
fT
Cutoff Frequency (MHz)
Collector Current (A)
100
0.1 PT=1 ms PT=100 ms PT=1 s
10 1 10 100 1000
0.01 1 10 100 1000
Collector Current (mA)
Forward Voltage (V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126ML Dimension
Marking :
Spec. No. : HE6601-C Issued Date : 1993.03.15 Revised Date : 2000.10.01 Page No. : 3/3
A
B D E F 3 2 I G 1 J M L K O H
HSMC Logo Part Number Date Code
Product Series Rank
Ink Marking
C
Style : Pin 1.Emitter 2.Collector 3.Base
N
3-Lead TO-126ML Plastic Package HSMC Package Code : D *:Typical
DIM A B C D E F G H
Inches Min. Max. 0.1356 0.1457 0.0170 0.0272 0.0344 0.0444 0.0501 0.0601 0.1131 0.1231 0.0737 0.0837 0.0294 0.0494 0.0462 0.0562
Millimeters Min. Max. 3.44 3.70 0.43 0.69 0.87 1.12 1.27 1.52 2.87 3.12 1.87 2.12 0.74 1.25 1.17 1.42
DIM I J K L M N O
Inches Min. Max. *0.1795 0.0268 0.0331 0.5512 0.5906 0.2903 0.3003 0.1378 0.1478 0.1525 0.1625 0.0740 0.0842
Millimeters Min. Max. *4.56 0.68 0.84 14.00 15.00 7.37 7.62 3.50 3.75 3.87 4.12 1.88 2.14
Notes : 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification

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